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SKU:20717978
Feature:1. Applicability: The ball mounting platform is mainly used for ball mounting of large BGA chip product functions (including CPU, GPU, PCH).2. Double Base: Complete supporting facilities, double base, matching magnetic base, super magnetic, easy to operate and high efficiency.3. Precise Hole Position: The steel mesh is precise and durable, the hole position is precise, and no secondary positioning is required.4. Material: The BGA chip ball mounting platform is made of high quality steel mesh material, which is durable and easy to use.5. Strong Magnetic Force: Super strong magnetic adsorption and bonding, and the magnetic base is high accurate bonding.Specification:Item Type: Reballing StationMaterial: Steel MeshModel: DS 201ASpecification:8 9 Gen CPU/0.45: 8th Generation 9th Generation Low Voltage for CPU Chip Stencil, 0.45 Solder Ball2 3 Gen CPU/0.45: 2nd Generation 3rd Generation Low Voltage for CPU Chip Stencil, 0.45 Solder Ball2 3 Gen I7 CPU/0.4: 2 Gen 3 Gen Low Voltage i7INTELCPU Chip Stencil, 0.4 Solder Ball6 7 Gen CPU/0.45: 6th Generation 7th Generation Low Voltage for CPU Chip Stencil, 0.45 Solder Ball10 Gen CPU/0.45: 10th Generation Low Voltage for CPU Chip Stencil, 0.45 Solder Ballfor OS PC Gpu/0.45: for OS PC Graphics Chip Stencil, 0.45 Solder Ballsfor Gpu/0.45: for Graphics Chip Stencil, 0.45 Solder BallsNV Gpu/0.45: NV Graphics Card Chip Stencil, 0.45 Solder Ball 45genCPU/0.45: 4th Generation 5th Generation Low Voltage for CPU Chip Stencil, 0.45 Solder Ball Sr21715/0.3: A 153415 CPU Chip Stencil, 0.3 Tin Ball4 Gen HQCPU/0.45: 4th Generation Standard Pressure for CPU Chip Steel Mesh, 0.45 Solder Ball2 3 Gen PCH/0.35: 2 Gen 3 Gen PCH South Bridge Chip Stencil, 0.35 Solder Balls6 Gen HQCPU/0.45: 6th Generation Standard Pressure for CPU Chip Steel Mesh, 0.45 Solder Ball4 Gen PCH/0.35: 4 Gen Pch South Bridge Chip Stencil, 0.35 Solder BallsHow
Applicability: The ball mounting platform is mainly used for ball mounting of large BGA chip product functions (including CPU, GPU, PCH).
Strong Magnetic Force: Super strong magnetic adsorption and bonding, and the magnetic base is high accurate bonding.
Double Base: Complete supporting facilities, double base, matching magnetic base, super magnetic, easy to operate and high efficiency.
Material: The BGA chip ball mounting platform is made of high quality steel mesh material, which is durable and easy to use.
Precise Hole Position: The steel mesh is precise and durable, the hole position is precise, and no secondary positioning is required.